Dimethyl-bis[[methyl(diphenyl)silyl]oxy]silane
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- Molecular formula
- C28H30O2Si3
- CAS Number
- 3027-21-2
- IUPAC Name
- dimethyl-bis[[methyl(diphenyl)silyl]oxy]silane
- Molecular Weight
- 474.99g/mol
- Melting Point
- (Celsius)
- Boiling Point
- (Celsius)
- Density
- 1.1500g/cm3
- Synonyms
- 3982-82-9
Identification
Interesting facts
Interesting Facts about Dimethyl-bis[[methyl(diphenyl)silyl]oxy]silane
Dimethyl-bis[[methyl(diphenyl)silyl]oxy]silane is a fascinating compound that showcases the versatility and complexity of organosilicon chemistry. Here are several intriguing facts about this compound:
- Organosilicon Specialization: This compound is a prime example of organosilicon materials, which are crucial in various high-tech applications, including electronics and adhesives.
- Silicone Chemistry: The presence of both dimethyl and diphenyl groups in the silane structure highlights the interplay between different silicon substituents. This variability allows chemists to tailor properties for specific applications.
- Applications: Dimethyl-bis[[methyl(diphenyl)silyl]oxy]silane is primarily utilized in:
- Coatings and sealants due to its stability and durability.
- As a precursor in the synthesis of silicon-based polymers.
- In the formulation of advanced sealants for electronic devices, where moisture and contaminants must be minimized.
- Functionalization: The modified silane can be used to introduce functionality on surfaces, enhancing properties like hydrophobicity or compatibility with other materials.
- Research Applications: As a research compound, it often serves as a building block for studying silicon-based materials and their potential in nanotechnology, particularly in the development of composite materials.
In summary, Dimethyl-bis[[methyl(diphenyl)silyl]oxy]silane is more than just a chemical compound; it represents a nuanced field of study in materials science and engineering. Its innovative applications and interesting properties make it a subject of continuous research and development.